COURSE UNIT TITLE

: THERMAL MANAGEMENT OF ELECTRONIC PACKAGING

Description of Individual Course Units

Course Unit Code Course Unit Title Type Of Course D U L ECTS
MEE 5084 THERMAL MANAGEMENT OF ELECTRONIC PACKAGING ELECTIVE 3 0 0 8

Offered By

Graduate School of Natural and Applied Sciences

Level of Course Unit

Second Cycle Programmes (Master's Degree)

Course Coordinator

PROFESSOR DOCTOR ALPASLAN TURGUT

Offered to

Energy
Energy
Energy

Course Objective

In recent, electronic industry rapidly develop, but thermal challenges cause problems in electronic industry to ensure continuous development in device and system performance. Performance requirements increase for smaller, more capable and efficient electronic systems to dissipate heat efficiently. This requires that the materials have a high capability for dissipating heat and maintaining compatibility with the die and electronic packaging. A variety of new advanced composed materials are now available which provide more advantages over conventional for electronic packaging thermal control including; high thermal conductivity, low coefficients of thermal expansion, size reduction, low density, weight reduction, lower thermal stresses, increased reliability, get easy thermal design, low cost and net shape fabrication processed, potential cost reductions. The aim of this course is to provide an understanding of the way thermal management of electronic packing.

Learning Outcomes of the Course Unit

1   This course is expected to help the student to understand of the way thermal management materials
2   To give the students further instruction on tools of how to measure the thermal characteristics of materials by analytical techniques
3   To develop the students information about various matrix composites
4   To develop the students ability to choose materials for types of cooling
5   To develop the students ability to present and criticize arguments on new developments in thermal materials in electronic packaging.

Mode of Delivery

Face -to- Face

Prerequisites and Co-requisites

None

Recomended Optional Programme Components

None

Course Contents

Week Subject Description
1 Overview of thermal management fundamentals in electronic packaging
2 Characterization methodologies of thermal management materials
3 Electronic packaging materials and their function in thermal management
4 Monolithic carbonaceous materials and carbon matrix composites
5 Thermally conductive polymer matrix composites
6 High thermal conductivity metal matrix composites
7 Thermally conductive ceramic matrix composites
8 Thermal interface materials in electronic packaging
9 Materials and design for advanced heat spreader and air cooling heat sinks
10 Liquid cooling devices and their materials selection
11 Thermoelectric cooling through thermoelectric materials
12 Development and application of advanced thermal management materials
13 Student presentation
14 Student presentation

Recomended or Required Reading

Textbook(s): Tong, X., C.: Advanced Materials for Thermal Management of Electronic packaging, Springer, 2011

Planned Learning Activities and Teaching Methods

The course is taught in a lecture, class presentation and discussion format. All class members are expected to attend and both the lecture and seminar hours and take part in the discussion sessions. Besides the taught lecture, group presentations are to be prepared by the groups assigned for that week and presented to open a discussion session.

Assessment Methods

SORTING NUMBER SHORT CODE LONG CODE FORMULA
1 ASG ASSIGNMENT
2 PAR PARTICIPATION
3 FIN FINAL EXAM
4 FCG FINAL COURSE GRADE ASG * 0.40 +PAR * 0.10 +FIN * 0.50
5 RST RESIT
6 FCGR FINAL COURSE GRADE (RESIT) ASG * 0.40 +PAR * 0.10 + RST * 0.50


*** Resit Exam is Not Administered in Institutions Where Resit is not Applicable.

Further Notes About Assessment Methods

None

Assessment Criteria

Learning outcomes will be assessed by assignments and final exam.

Language of Instruction

English

Course Policies and Rules

To be announced.

Contact Details for the Lecturer(s)

alpaslan.turgut@deu.edu.tr

Office Hours

Friday 9:00-11:00

Work Placement(s)

None

Workload Calculation

Activities Number Time (hours) Total Work Load (hours)
Lectures 12 3 36
Student Presentations 2 3 6
Preparations before/after weekly lectures 12 7 84
Preparing presentations 1 60 60
Preparation for final exam 1 12 12
Final 1 2 2
TOTAL WORKLOAD (hours) 200

Contribution of Learning Outcomes to Programme Outcomes

PO/LOPO.1PO.2PO.3PO.4PO.5PO.6PO.7PO.8PO.9PO.10PO.11PO.12PO.13
LO.13325
LO.24344245
LO.3245
LO.43335
LO.5325